October 15-17, 2007

Amphenol Sine Systems will be attending PACK EXPO Las Vegas 2007. This show will focus on the latest developments in packaging technology and will showcase exhibitors’ state-of-the-art advances in packaging machinery, converting machinery, materials, packages and containers, and components. PACK EXPO Las Vegas 2007 will continue to be held biennially on the odd-numbered years—ideal timing for new product technology. Exhibitors will bring their top technicians and engineers to provide packaging solutions to even the toughest packaging challenges.